ball bond meaning in English
球形键合
球压焊
Examples
- Specifications for fully automatic gold wire ball bonder
全自动金丝球焊接机技术条件 - As a contrast object , gold wire ball bonding technology was also studied
金丝球键合作为对比研究对象引入本文研究范围。 - Figure 7 : tail or crescent bond is the shape of the thermosonic bond on the substrate ( ball bond is on dimensions are shown in the box to the right of the figure
月牙形焊接（热超声焊的末端）的尺寸和形状直接与引线直径和毛细管的几何形状有关。 - Trough the experiment , we probed to the suited mount method ( mount with 183 soldering paste ) and bonding technique ( ball bonding with the gold silks of 18 m in diameter )
通过实验，探索出了合适的贴装方式( 183焊膏贴装)和管芯键合工艺(直径18 m的金丝球焊) 。 - Figure 6 : drawing3 showing wedge bonding operation on the second bond , at the substrate bondinger . figure 7 : tail or crescent bond is the shape of the thermosonic bond on the substrate ( ball bond is onthe die side )
月牙形焊接（热超声焊的末端）的尺寸和形状直接与引线直径和毛细管的几何形状有关。